Crystals | Free Full-Text | Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
The intermetallic layer of solder joints: a) Infrared heating method, | Download Scientific Diagram
Evaluation of intermetallic compound layer at aluminum/steel interface joined by friction stir scribe technology - ScienceDirect
Effect of shape-memory alloy NiTi fiber on microstructure and mechanical properties of continuous ceramic Al2O3 fiber-reinforced Ti/Al3Ti metal– intermetallic laminated composite - Yuqiang Han, Junyi Zhu, Haoran Yan, Chunfa Lin, Zhilei Zhao, Xuecong
Cross-section BSE images of the substrate-side IMC layers after thermal... | Download Scientific Diagram
The Role of Aluminium in Continuous Galvanizing - Ark Novin
Materials | Free Full-Text | Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
Effect of aging mode on the IMC growth of SAC(305)/Cu solder joints during aging
Gold–aluminium intermetallic - Wikipedia
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections | SpringerLink
Figure 2 from Investigation of the wetting properties of Cu6Sn5 intermetallic compound | Semantic Scholar
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces | Emerald Insight
Microsection | BGA Cross Section Analysis
Figure 10 from Investigating the mechanical strength of Vapor Phase soldered chip components joints | Semantic Scholar
Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints
Cross section morphology of Cu 6 Sn 5 IMC grown at the interface of... | Download Scientific Diagram
Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate
Cross-Sectional Analysis — Elmet
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene | ACS Applied Materials & Interfaces
Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders
Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad - ScienceDirect
Applying microscopic analytic techniques for failure analysis in electronic assemblies | Applied Microscopy | Full Text
Microsection / Cross-Section Analysis
